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Wafer Foundry Services

Have your custom products outgrown the university environment, or do you require a level of customization at lower volumes that is not always supported in pure-play semiconductor foundries? Our team of experienced process engineers can help you manufacture your custom projects on 150 or 200 mm wafer diameters at one of our three IATF-16949 certified wafer fabs located in the United States. We offer core competencies in the following areas:

  • CMOS
  • Bipolar-CMOS-DMOS (BCD)
  • Embedded Nonvolatile Memory (eNVM)
  • Silicon-on-Insulator (SOI) high-voltage technologies
  • Charge Coupled Devices (CCDs)
  • Micro-Electrical Mechanical Systems (MEMS)

To learn more about how our wafer foundry services can meet your specific requirements, please contact foundryservices@microchip.com.

Full and Semi-Custom Processes

  • Transfer your existing process from another fab or university
  • Create a custom process using our vast catalog of standard process modules


  • Standard process flows available at various nodes that can be tailored to your specifications
  • I-line lithography with stitching option available for large sensors


  • Thin wafer handling
  • Specialized equipment including: DRIE, backside processing with frontside alignment, wafer bonder, 1X aligner, KOH etch and CPD

Unit Processes

  • Epitaxial silicon growth
  • Ion implant
    • Species available: B, P, As, Sb
    • Wide range of doses and energies available